Annealing Process

Overview

As the density of semiconductor becomes higher and its pattern becomes finer, Rapid  Thermal Annealing (RTA) is attracting attention as an important heating technique in the semiconductor fabrication process. The class 10000 cleanroom will make available two (2) units of rapid thermal annealer to support the high density semiconductor fabrication processing.

Mini Lamp Annealer MILA-3000

The MILA-3000 has integrated excellent characteristics, such as capabilities of rapid heating/cooling of the infrared gold image furnace, high precision temperature control, clean heating and versatile atmosphere selection, in a compact unit and features moderate price, small size and high performance.

Max Size: Less than (20 x 20) mm.

Availability: To be advised.

Contact: e6nanofab@nus.edu.sg

System Overview

The Magnetic Annealing System is an 8.0 Tesla Magnetic Annealing System for pilot line and R&D usage.

Technical Specifications

• Magnetic field: 0 to 8.0 Tesla
• Wafer size: Ø2” (51 mm) circular diameter & 5 product wafers
• Wafer orientation: In plane or perpendicular to magnetic field direction
• Field homogeneity: -2/+2% over product wafers
• Field uniformity: Angle <+/-1.5° over product wafers
• Set-point accuracy: <5 mTesla
• Field stability: <0.1% of field value
• Field reproducibility: <5 mTesla
• Temperature range: 200 – 450°C
• Max wafer exit temp: 60°C
• Thermal uniformity: < ±3°C in sample volume
• Set point accuracy: ±1.5°C
• Cross wafer uniformity: ±2°C
• Cross stack uniformity: ±1.5°C

Location
E6-01-02, Class 100 Cleanroom

Contact
Email: e6nanofab@nus.edu.sg
Tel: 660 17030